Process design for reducing the warpage in thin-walled injection molding

International Polymer Processing

Volumn 17, Issue 2, 2002, Pages 146-152

  Wang, T H ^a   Young, W B ^a   Wang, J ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

PLASTIC;

ARTICLE; MELTING POINT; PLASTIC INDUSTRY; PRESSURE; PROCESS DESIGN; SIMULATION; TEMPERATURE DEPENDENCE;

EID: 0036298019     PISSN: 0930777X     EISSN: None     Source Type: Journal    
DOI: 10.3139/217.1688     Document Type: Article

References (9)