Board level solder joint reliability modeling of LFBGA package

International Symposium on Electronic Materials and Packaging, EMAP 2000

Volumn , Issue , 2000, Pages 51-54

  Tee, Tong Yan ^a   Sivakumar, K ^a   Do Bento Vieira, Antonio ^a  

^a STMICROELECTRONICS   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; DESIGN; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FATIGUE TESTING; FORECASTING; MODIFIED ATMOSPHERE PACKAGING; PACKAGING MATERIALS; SOLDERING; STRAIN ENERGY; THERMAL CYCLING;

CORRELATION CONSTANTS; LIFE PREDICTIONS; MATERIAL COMBINATION; PACKAGE CONFIGURATIONS; SOLDER JOINT RELIABILITY; STRAIN ENERGY DENSITY; SUBSTRATE SIZES; THERMAL CYCLING TEST;

PACKAGING;

EID: 0002941912     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2000.904132     Document Type: Conference Paper

References (7)

1. Darveaux, R., Banerji, K., Mawer, A., and Dody, G., "Reliability of Plastic Ball Grid Array Assembly," Ball Grid Array Technology, L. Lau Editor, McGraw-Hill, Inc., New York, 1995, pp.379-442.
2. Darveaux, R., "Solder Joint Fatigue Life Model," Proc. TMS Annual Meeting, 1997, pp. 213-218.
3. Johnson, Z., "Implementation of and Extensions to Darveaux's Approach to Finite-Element Simulation of BGA Solder Joint Reliability," 1999 ECTC Conference Technical Proceedings.
4. Mawer, A., Vo, N., Johnson, Z., and Lindsay, W., "Board-Level Characterization of 1.0 and 1.27 mm Pitch PBGA for Automotive Under-Hood Applications," 1999 ECTC Conference Technical Proceedings.
5. Nguyen, L.T., and Lee, W.W., "Solder Joint Fatigue Models-Critical Review and Applicability to Chip Scale Packages," Microelectronics Reliability, 1999.
6. Murty, K.L., and Turlik, I., "Deformation Mechanisms in Lead-Tin Alloys, Application to Solder Reliability in Electronic Packages," ASME/JSME, 1992, pp. 309-318.
7. Ansys User's Manual, Swanson Analysis Systems, Inc., 1994, Vol. IV, pp. 4.23-25.