Understanding modulus trends in ultra low K dielectric materials through the use of molecular modeling

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1318-1322

  Iwamoto, Nancy ^a   Moro, L ^a   Bedwell, B ^a   Apen, P ^a  

^a HONEYWELL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL MECHANICAL POLISHING; DENSITY (SPECIFIC GRAVITY); EXTRAPOLATION; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT MANUFACTURE; INTERFACIAL ENERGY; MACROMOLECULES; MICROSTRUCTURE; MOLECULAR DYNAMICS; MOLECULAR STRUCTURE; PERMITTIVITY; PORE SIZE; POROUS MATERIALS; STOICHIOMETRY; WETTING;

MACROMOLECULAR ARCHITECTURES;

DIELECTRIC MATERIALS;

EID: 0036297037     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2002.1008276     Document Type: Article

References (5)

1. Porous ILD: NANOGLASS® dielectric extendibility
2. Ultra low k organic dielectric films
3. A property trend study of polybenzimidazole using molecular modeling
4. Applying polymer process studies using molecular modeling