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Volumn 18, Issue 12 SPECIAL EDITION, 2001, Pages 28-30
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Hermetic packaging: A neglected 'Holy Grail'?
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Author keywords
[No Author keywords available]
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Indexed keywords
CHIP SCALE PACKAGES;
COST EFFECTIVENESS;
FIBER OPTICS;
HUMIDITY CONTROL;
RELIABILITY;
SEALING (CLOSING);
SOLDERING;
SPECIFICATIONS;
TENSILE STRENGTH;
THERMAL EFFECTS;
THERMAL EXPANSION;
HERMETIC PACKAGING;
HERMETIC SEALS;
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EID: 0035888463
PISSN: 07415834
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Article |
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Times cited : (1)
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References (0)
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