Stress/strength and reliability evaluations on UBM in different solder systems

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2000, Pages 193-199

  Guo, Yifan ^a   Kuo, Shun Meen ^a   Mercado, Lei ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EUTECTICS; FLIP CHIP DEVICES; INTEGRATED CIRCUIT TESTING; LEAD METALLURGY; MATHEMATICAL MODELS; RELIABILITY; SOLDERING ALLOYS; STRESS ANALYSIS; TENSILE STRESS; THERMAL CYCLING;

FLIP CHIP BUMPING TECHNOLOGY; STRESS MODEL; UNDER BUMP METALLURGY;

THERMAL STRESS;

EID: 0033710311     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (2)