Design for reliability of micro-electro-mechanical systems (MEMS)

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 760-762

  McCluskey, Patrick ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; OPTICAL INTERCONNECTS; RELIABILITY; SENSORS;

MICROSYSTEMS;

MICROELECTROMECHANICAL DEVICES;

EID: 0036287423     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. A Web-based graduate course on the mechanical design of high temperature and high power electronics