A web-based graduate course on the mechanical design of high temperature and high power electronics

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 397-400

  McCluskey, P ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED INSTRUCTION; DISTRIBUTED PARAMETER CONTROL SYSTEMS; FATIGUE OF MATERIALS; MAINTAINABILITY; PERFORMANCE; RELIABILITY; SOLID STATE DEVICES; THERMOANALYSIS;

MECHANICAL PACKAGING DESIGN; SOLID-STATE ELECTRONIC MODULES; WEB-BASED GRADUATE COURSE;

ELECTRONICS PACKAGING;

EID: 0034835526     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Integrated circuit, hybrid, and multichip module package design guidelines: A focus on reliability
2. Interdisciplinary, multi-instructor graduate education in electronics packaging
3. Electronic packaging education: A view from 1992 and 1996 Conferences
4. Global electronic packaging education at Georgia tech PRC
5. High temperature electronics