On the frequencydependent line capacitance and conductance of onchip interconnects on lossy silicon substrate

Microelectronics International: An International Journal

Volumn 19, Issue 1, 2002, Pages 11-18

  Ymeri, H ^a   Nauwelaers, B ^a   Maex, K ^a  

^a IMEC   (Belgium)

Author keywords

Interconnection; Multiconductor transmissions

Indexed keywords

EID: 0036238958     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565360210417736     Document Type: Article

References (26)

1. Aubourg, M., Villotte, J.P., Godon, F. and Garault, Y. (1983), “Finiteelement analysis of lossy waveguides—application of microstrip lines on semiconductor substrate”, IEEE Trans. Microwave Theory Tech., Vol. MTT-31, pp. 326‐31.
2. Brews, J.R. (1986), “Transmission line models for lossy waveguide interconnections in VLSI”, IEEE Trans. Electron Devices, Vol.ED-33, pp. 1356‐65.
3. Deutsch, A., Kopcsay, G.V., Surovic, C.W., Rubin, B.J., Terman, L.M., Dunne, R.P., Gallo, T.A. and Dennard, R.H. (1995), “Modelling and characterization of long on-chip interconnections for high-performance microprocessors”, IBM J. Res. Dev., Vol. 39, pp. 547‐67.
4. Eo, Y. and Eisenstadt, W.R. (1993), “High-speed VLSI interconnect modelling based on S-parameters measurements”, IEEE Trans. Comp. Hybrids, Manuf. Technol., Vol. 16, pp. 555‐62.
5. Goossen, K.W. and Hammond, R.B. (1989), “Modelling of picosecond pulse propagation in microstrip interconnections on integrated circuits”, IEEE Trans. Microwave Theory Tech., Vol. MTT-37, pp. 459‐65.
6. Groteluschen, E., Dutta, L.S. and Zaage, S. (1994), “Quasi-analytical analysis of the broadbend properties of multiconductor transmission lines on semiconducting substrates”, IEEE Trans. Comp., Pack. Manuf. Technol., Part B, Vol. 17, pp. 376‐82.
7. Harrington, R.F. (1968), Field Computation by Moment Methods, The Macmillan Company, New York, NY.
8. Hasegawa, H., Furukawa, M. and Yanai, H. (1971), “Properties of microstrip line on Si–SiO system”, IEEE Trans. Microwave Theory Tech., Vol. MTT-19, pp. 869‐81.
9. Hasegawa, H. and Seki, S. (1984), “Analysis of interconnection delay on very high-speed LSI/VLSI chips using an MIS microstrip line model”, IEEE Trans. Electron Devices, Vol. ED-31, pp. 347‐52.
10. Kwon, Y.R., Hietala, V.M. and Champlin, K.S. (1987), “Quasi-TEM analysis of ‘slow-wave’ mode propagation on coplanar microstructure MIS transmission lines”, IEEE Trans. MicrowaveTheory Tech., Vol. MTT-35, pp. 545‐51.
11. Mesa, F.L., Cano, G., Medina, F., Marques, R. and Horno, M. (1992), “On the quasi-TEM and full-wave approaches applied to coplanar multistrip on lossy dielectric layered media”, IEEE Trans. Microwave Theory Tech., Vol. MTT-40, pp. 524‐31.
12. Mu, T.C., Ogawa, H. and Itoh, T. (1986), “Characteristics of multiconductor, asymmetric, slow-wave microstrip transmission lines”, IEEE Trans. Microwave Theory Tech., Vol. MTT-34, pp. 1471‐77.
13. Pan, G.W., Wan, G. and Gilbert, B.K. (1992), “Edge effect enforced boundary element analysis of multilayered transmission lines”, IEEE Trans. Circuits Syst.—I, Vol. 39, pp. 955‐63.
14. Shibata, T. and Sano, E. (1990), “Characterization of MIS structure coplanar transmission lines investigation of signal propagation in integrated circuits”, IEEE Trans. Microwave Theory Tech., Vol. MTT-38, pp. 881‐90.
15. Sorrentino, R., Leuzzi, G. and Silbermann, A. (1984), “Characteristics of metal–insulator–semiconductor coplanar waveguides for monolithic microwave circuits”, IEEE Trans. Microwave Theory Tech., Vol. MTT-32, pp. 410‐16.
16. Warns, C., Menzel, W. and Schumacher, H. (1998), “Transmission lines and passive elements for multilayer coplanar circuits on silicon”, IEEE Trans. Microwave Theory Tech., Vol. MTT-46, pp. 616‐22.
17. Wei, C., Harrington, R.F., Mautz, J.R. and Sarkar, T.K. (1984), “Multiconductor transmission lines in multilayered dielectric media”, IEEE Trans. Microwave Theory Tech., Vol. MTT-32, pp. 439‐42.
18. Wheeler, H.A. (1942), “Formulas for the skin effect”, Proc. IRE, Vol. 33, pp. 412‐24.
19. Williams, D.F. and Marks, R.B. (1993), “Accurate transmission line characterization”, IEEE Microwave Guided Wave Lett., Vol. 3, pp. 247‐49.
20. Ymeri, H., Nauwelaers, B. and Maex, K. (2000a), “Simple and accurate analysis of interconnects in high speed integrated circuits”, Proc. European Workshop Materials for Advanced Metallization (MAM 2000), 28 Feb.–1 March 2000, Stresa, Italy, pp. 142‐3.
21. Ymeri, H., Nauwelaers, B. and Maex, K. (2000), “Computation of capacitance matrix for integrated circuit interconnnects using semi-analytical Green's function method”, Integration, the VLSI J., Vol. 30, pp. 55‐63.
22. Ymeri, H., Nauwelaers, B. and Maex, K. (2001), “Fast and accurate analysis of the multiconductor interconnects”, Microelectron. Engng, Vol. 55, pp. 37‐42.
23. Yuan, J.S., Eisenstadt, W.R. and Liou, J.J. (1990), “A novel lossy and dispersive interconnect model for integrated circuit simulation”, IEEE Trans. Comp. Hybrids, Manuf. Technol., Vol. 13, pp. 275‐80.
24. Zaage, S. and Groteluschen, E. (1993), “Characterization of the broadband transmission behaviour of interconnects on silicon substrates”, IEEE Trans. Comp. Hybrids, Manuf. Technol., Vol. 16, pp. 686‐91.
25. Zheng, J., Hahm, Y.-C., Weisshaar, A. and Tripathi, V.K. (1999), “CAD-oriented equivalent-circuit modeling of on-chip interconnects for RF integrated circuits in CMOS technology”, 1999 IEEE MTT-S Int. Microwave Symp. Digest, Anaheim, CA, Paper MO1D-3, June 13–19, 1999, pp. 35‐8.
26. Zheng, J. and Li, Z.F. (1997), “Accelerating capacitance computation for interconnects in high speed MCM by Pade approximation”, Electron. Lett., Vol. 33, pp. 217‐18.