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Journal of Materials Chemistry

Volumn 12, Issue 4, 2002, Pages 1090-1093

Coefficient of thermal expansion for solder alloys based on cluster expansion method

(2) Hong, Mei Jin a Wu, Ping a

a INSTITUTE OF HIGH PERFORMANCE COMPUTING (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

LEAD; SILVER; TIN;

ANALYTIC METHOD; ARTICLE; CALCULATION; CLUSTER EXPANSION METHOD; CORRELATION COEFFICIENT; MATHEMATICAL ANALYSIS; MONTE CARLO METHOD; SIMULATION; STRUCTURE ANALYSIS; THEORY; THERMAL ANALYSIS; VIBRATION;

EID: 0036227004 PISSN: 09599428 EISSN: None Source Type: Journal
DOI: 10.1039/b106139a Document Type: Article

Times cited : (10)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.