SCOPUS 정보 검색 플랫폼

Volumn 11, Issue 1, 2002, Pages 30-33

Next-generation packaging for fiber optics & MEMS

(4) Horowitz, Samuel J a Amey, D I a Taylor, B E a Doyle, M a

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; DENSE WAVELENGTH DIVISION MULTIPLEXING; DIELECTRIC MATERIALS; FIBER OPTIC NETWORKS; FIBER OPTICS; INTEGRATED CIRCUITS; MICROELECTROMECHANICAL DEVICES; OPTICAL INTERCONNECTS; OPTOELECTRONIC DEVICES; RESISTORS; THICK FILMS;

LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) MATERIALS; MICROELECTROMECHANICAL SYSTEMS (MEMS);

ELECTRONICS PACKAGING;

EID: 0036071191 PISSN: 10650555 EISSN: None Source Type: Trade Journal
DOI: None Document Type: Article

Times cited : (6)

References (12)

1
- 0004234411
- Thick film hybrids
- ASM international, New York
- (1989) Electronic Materials Handbook , vol.1 , pp. 332
- Borland, W.¹

2
- 0003283089
- Cost effective solutions for high density interconnect and RF modules using low temperature cofired ceramic materials
- April
- (2000) Proceedings of 2000 IEMT
- Needes, C.R.S.¹ Amey, D.I.² Horowitz, S.J.³

3
- 0005782857
- RHK, Telecommunication Industry Analysis

4
- 0033328210
- Characterization of low loss LTCC materials at 40 GHz
- (1999) Proceedings of IMAPS 1999 Intl, Symp. on Microelectronics , pp. 89-93
- Amey, D.I.¹ Horowitz, S.J.²

5
- 0005781877
- Thick-film technology offers high packaging density
- February
- (1999) Microwaves and RF
- Skurski, M.A.¹

6
- 0034829878
- New photoimageable LTCC technology for making a wide range of ceramic architectures and circuits
- (2001) Proceedings of the International Conference on High Density Interconnect and Systems Packaging , pp. 87-92
- Taylor, B.E.¹ Bidwell, L.² Lawrence, A.³

7
- 2042511181
- Ceramics, glass, and micas
- Charles A. Harper, ed., McGraw Hill, New York, 6-12 through
- (1970) Handbook of Materials and Processes for Electronics , pp. 6-42
- Harrison, D.E.¹ Moratis, C.J.²

8
- 0002266859
- Low loss tape materials system for 10 to 40 GHz application
- (2000) Proceedings of IMAPS 2000 Intl. Symp. on Microelectronics , pp. 654-658
- Amey, D.I.¹

9
- 0005822401
- Through-hole plugs and thermal vias
- (2000) Proceedings of IMAPS 2000 Intl. Symp. on Microelectronics , pp. 325-329
- Crumpton, J.C.¹ Cofield, V.E.² Bacher, R.J.³

10
- 0027189519
- Green tape via design-FEM and proposed design philosophy
- (1993) Proceedings of the Electronic Component and Technology Conference , pp. 904-909
- Poulin, T.R.¹ Nguyen, L.T.²

11
- 0005780914
- Hermetic packaging for optoelectronic and high frequency applications
- (2001) Proceedings of 2001 Nepcon Conference
- Keusseyan, R.¹

12
- 0005855727
- RF module solutions for wireless applications
- June
- (2000) Workshop Notes 2000 IEEE MTT-S International Microwave Symposium
- Brown, R.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.