A study of thermal effects in RF-MEM-switches using a time domain approach

IEEE MTT-S International Microwave Symposium Digest

Volumn 1, Issue , 2002, Pages 235-238

  Thiel, Werner ^a   Tornquist, Kelly ^a   Reano, Ron ^a   Katehi, Linda P B ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; HEAT CONDUCTION; MATHEMATICAL MODELS; STRESS CONCENTRATION; TEMPERATURE DISTRIBUTION; THERMAL EFFECTS; TIME DOMAIN ANALYSIS; TIME SWITCHES;

FINITE DIFFERENCE TIME DOMAIN METHOD; HEAT EQUATION; MICROMECHANICAL SYSTEMS;

MICROELECTROMECHANICAL DEVICES;

EID: 0036070460     PISSN: 0149645X     EISSN: None     Source Type: Journal    
DOI: 10.1109/MWSYM.2002.1011601     Document Type: Article

References (10)

1. Numerical modelling of 3-D coupled electromagnetic and heating diffusion problems
2. Numerical solution of initial boundary value problems involving Maxwell’s equation in isotropic media
3. A surface impedance approach for modeling transmission line losses in FDTD
4. A conducting sheet model for efficient wide band FDTD analysis of planar waveguides and circuits
5. MEMS single-pole double-throw (SPDT) X and K-band switching circuits
6. Design of low actuation voltage RF MEMS switch
7. Integrated electro-thermal probe