A novel directional coupler for PCB and LTCC applications

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 2002, Pages 2225-2228

  Sawicki, Andrzej ^a   Sachse, Krzysztof ^a  

^a ERICSSON RESEARCH   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; DIELECTRIC MATERIALS; ELECTRIC CONDUCTORS; MULTILAYERS; PERMITTIVITY; PRINTED CIRCUIT BOARDS; SUBSTRATES; TUNING;

DIELECTRIC PERMITTIVITY; DIRECTIONAL COUPLER; LOW TEMPERATURE COFIRED CERAMIC;

COUPLED CIRCUITS;

EID: 0036065854     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

1. LTCC-M: An enabling technology for high performance multiplayer RF systems
2. Low loss green tape for wireless and microwave applications
3. MIC overlay coupler design using spectral domain techniques
4. Quasi-ideal multiplayer two- and three-strip directional coupler for monolithic and hybrid MICs
5. Generalized spectral domain method for multiconductor printed lines and its application to tunable suspended microstrips
6. Analysis and applications of modified coupled coplanar lines
7. A high directivity microstrip coupler technique
8. Design of high directivity directional couplers in multilayer ceramic technologies
9. Analysis and design of ideal non symmetrical coupled microstrip directional coupler
10. The scattering parameters and directional coupler analysis of characteristically terminated asymmetric coupled transmission lines in an inhomogeneous medium
11. Lower and upper bound calculations on the capacitance of multiconductor printed transmission line using the spectral-domain approach and variational method