Design of high directivity directional couplers in multilayer ceramic technologies

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 2001, Pages 51-54

  Al taei, Sarmad ^a   Lane, Phil ^a   Passiopoulos, George ^b  

^a UNIVERSITY COLLEGE LONDON   (United Kingdom)

^b NOKIA SIEMENS NETWORKS   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPUTER SIMULATION; HYBRID INTEGRATED CIRCUITS; INTEGRATED CIRCUIT LAYOUT; MICROSTRIP LINES; MICROWAVE INTEGRATED CIRCUITS; MOTION COMPENSATION; MULTILAYERS; PASSIVE NETWORKS; TRANSCEIVERS; VELOCITY;

AMALGAMATION; HIGH DIRECTIVITY DIRECTIONAL COUPLERS; MODE PHASE VELOCITY; MULTILAYER INTEGRATED CIRCUIT; MULTILAYERED COFIRED CERAMICS; PASSIVE COMPONENTS;

WAVEGUIDE COUPLERS;

EID: 0035689627     PISSN: 0149645X     EISSN: None     Source Type: Journal    
DOI: 10.1109/MWSYM.2001.966837     Document Type: Article

References (10)

1. MIC overlay coupler design using spectral domain techniques
2. Phase velocity compensation in parallel-coupled microstrip
3. A high directivity microstrip coupler technique
4. Microstrip directional couplers with ideal performance via single-element compensation
5. Multilayer MMIC branch-line coupler and broad-side coupler
6. Chip type spiral broadside coupler directional couplers and baluns using low temperature co-fired ceramic
7. Hybrid couplers in bilevel microstrip
8. Parameters of microstrip transmission lines of coupled pairs of microstrip lines