Trace analysis for 300 mm wafers and processes with total reflection X-ray fluorescence

Spectrochimica Acta - Part B Atomic Spectroscopy

Volumn 56, Issue 11, 2001, Pages 2301-2306

  Nutsch, A ^a   Erdmann, V ^a   Zielonka, G ^a   Pfitzner, L ^a   Ryssel, H ^a  

^a FRAUNHOFER INSTITUTE FOR INTEGRATED SYSTEMS AND DEVICE TECHNOLOGY IISB   (Germany)

Author keywords

300 mm Wafer; Contamination; Copper; Polishing; Reclaim; Silicon; TXRF

Indexed keywords

CONTAMINATION; FLUORESCENCE; NONDESTRUCTIVE EXAMINATION; POLISHING; SILICON WAFERS; X RAY ANALYSIS;

TOTAL REFLECTION X-RAY FLUORESCENCE;

TRACE ANALYSIS;

EID: 0035976302     PISSN: 05848547     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0584-8547(01)00286-5     Document Type: Article

References (5)