A procedure for gold soldering using a Si-Au alloy produced by Si implantation in Au

Modern Physics Letters B

Volumn 15, Issue 28-29, 2001, Pages 1339-1347

  Kennedy, V John ^a,b   Terwagne, G ^b   Demortier, G ^b  

^a GNS SCIENCE   (New Zealand)

^b UNIVERSITY OF NAMUR   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

GOLD; SILICON;

CONFERENCE PAPER; ELECTRON MICROSCOPY; ELECTRONICS INDUSTRY; IMPLANTATION; MATERIALS HANDLING; MEASUREMENT; RADIATION SCATTERING; SAMPLING;

EID: 0035924763     PISSN: 02179849     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0217984901003251     Document Type: Conference Paper

References (16)