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Journal of Electronic Materials

Volumn 24, Issue 8, 1995, Pages 927-933

Through-thickness characterization of copper electrodeposit

(3) De Angelis, R J a Knorr, D B b Merchant, H D c

a UNIVERSITY OF NEBRASKA LINCOLN (United States)

b RENSSELAER POLYTECHNIC INSTITUTE (United States)

c Gould Inc (United States)

Author keywords

Copper; dislocation density; electrodeposit; embrittlement; particle size; texture; twin spacing

Indexed keywords

EID: 51249166830 PISSN: 03615235 EISSN: 1543186X Source Type: Journal
DOI: 10.1007/BF02652963 Document Type: Article

Times cited : (20)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.