The problem for bonded half-planes containing a crack at an arbitrary angle to the graded interfacial zone

International Journal of Solids and Structures

Volumn 38, Issue 36-37, 2001, Pages 6559-6588

  Choi, Hyung Jip ^a  

^a Kookmin University   (South Korea)

Author keywords

Bonded media; Functionally graded materials; Inclined crack; Interfacial zone; Singular integral equations; Stress intensity factors

Indexed keywords

ELASTIC MODULI; FOURIER TRANSFORMS; INTEGRAL EQUATIONS; STIFFNESS MATRIX; STRESS INTENSITY FACTORS; TENSILE STRENGTH;

BONDED ELASTIC HALF-PLANES;

CRACK PROPAGATION;

CRACK; FRACTURE MECHANICS;

ENGINEERING; FRACTURE MECHANICS;

EID: 0035838947     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0020-7683(01)00090-7     Document Type: Article

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