Adhesive strength of electroplated copper films

Journal of Materials Processing Technology

Volumn 114, Issue 3, 2001, Pages 252-256

  Seah, C H ^a   Mridha, S ^b   Chan, L H ^c  

^a Thin Film Department   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c CHARTERED SEMICONDUCTOR MANUFACTURING LTD   (Singapore)

Author keywords

Delamination; Indenter; Radial cracking; Scratch resistance

Indexed keywords

COPPER; CRACK INITIATION; DELAMINATION; ELECTROPLATING; STRENGTH OF MATERIALS; SUBSTRATES;

ADHESIVE STRENGTH;

METALLIC FILMS;

EID: 0035822783     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(01)00624-0     Document Type: Article

References (5)