Impact of post via-etch cleans on mechanical reliability of W-plug vias

Thin Solid Films

Volumn 391, Issue 1, 2001, Pages 149-156

  Obeng, Y S ^a   Kang, S H ^a   Huang, J S ^a   Oates, A S ^a   Lin, X ^a   Obeng, J S ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

Corrosion; Electromigration; Interfaces; Metallization

Indexed keywords

ANNEALING; CHEMICAL ANALYSIS; CORROSION PROTECTION; ELECTROMIGRATION; INTERFACES (MATERIALS); METALLIZING; STRESS ANALYSIS;

AUGER CHEMICAL ANALYSIS; MULTI-LEVEL INTERCONNECTS;

PROTECTIVE COATINGS;

EID: 0035796946     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(01)00906-3     Document Type: Article

References (12)