Laser processing of adhesives and polymeric materials for microelectronics packaging applications

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000

Volumn , Issue , 2000, Pages 289-295

  Illyefalvi Vitez Z ^a  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

Costs; Dielectrics and electrical insulation; Integrated circuit interconnections; Laser beam cutting; Laser modes; Microelectronics; Optical materials; Plastic insulation; Polymers; Thermal conductivity

Indexed keywords

ADHESIVES; CHIP SCALE PACKAGES; COATINGS; COSTS; CUTTING; INSULATION; INTEGRATED CIRCUIT INTERCONNECTS; JOINING; LASER BEAM CUTTING; LASER BEAMS; LASER MODES; MANUFACTURE; MICROELECTRONICS; NEODYMIUM LASERS; OPTICAL MATERIALS; PAPER LAMINATES; PLASTIC COATINGS; POLYMER FILMS; POLYMERS; RECONFIGURABLE HARDWARE; SCREEN PRINTING; THERMAL CONDUCTIVITY; THERMAL INSULATION; THICK FILMS;

APPLICATION OF POLYMERS; GLASS FIBER-REINFORCED EPOXY; IMPROVE PERFORMANCE; INTEGRATED CIRCUIT INTERCONNECTIONS; INTERCONNECT SUBSTRATE; MICROELECTRONICS INDUSTRY; MICROELECTRONICS PACKAGING; POLYMER THICK FILMS;

LASER MATERIALS PROCESSING;

COSTS; INSULATION; LASERS; OPTICAL MATERIALS; POLYMERS; THERMAL CONDUCTIVITY;

EID: 1542639058     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.2000.860622     Document Type: Conference Paper

References (11)

1. Laser Drilling Techniques. Application Note, Electro Scientific Industries, Inc., 1996.
2. Wilson,J.; Hawkes,J.F.B.: Lasers Principles and Applications. Prentice Hall, New York, 1987, pp. 166-179.
3. Carslaw,H.S.; Jaeger,J.C.: Conduction of Heat in Solids. Oxford University Press, 1959.
4. Illyefalvi-Vitéz, Zs.; Pinkola, J.; Application of Laser Engraving for the Fabrication of Fine Resolution Printed Wiring Laminates for MCM-Ls. Proceedings of the 47th Electronic Components and Technology Conference, May 18-21, 1997, San Jose, California, pp. 502-510.
5. th Electronic Components and Technology Conference, May 25-28, 1998, Seattle, Washington USA, pp. 144-150.
6. nd International Spring Seminar on Electronics Technology, May 18-20, 1999, Freital-Dresden, Germany, pp.307-310.
7. th European Microelectronics & Packaging Conference, June 7-9, 1999, Harrogate (England), pp. 161-167.
8. Illyefalvi-Vitéz, Zs.; Ruszinkó, M.; Pinkola, J.: Laser Drilling and Pattern Processing for MCM-L Prototyping. Proceedings of the 1998 International Symposium on Microelectronics, Nov 1-4, 1998, San Diego, California, USA, pp. 89-94.
9. nd International Spring Seminar on Electronics Technology, May 18-20, 1999, Freital-Dresden, Germany, pp.146-151.
10. nd International Spring Seminar on Electronics Technology, May 18-20, 1999, Freital-Dresden, Germany, pp.311-314.
11. nd International Spring Seminar on Electronics Technology, May 18-20, 1999, Freital-Dresden, Germany, pp.315-32.