Alumina/NiCu Laminate under Thermal Shock up to 1000°C: II, Prediction of the Laminate Behavior

Journal of the American Ceramic Society

Volumn 84, Issue 3-12, 2001, Pages 2827-2833

  Sherman, Dov ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CERAMIC MATERIALS; CRACK INITIATION; FINITE DIFFERENCE METHOD; HIGH TEMPERATURE EFFECTS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; NICKEL COMPOUNDS; ONE DIMENSIONAL; RESIDUAL STRESSES; STRENGTH OF MATERIALS;

MONOLITHIC CERAMIC; ONE DIMENSIONAL SPATIO TEMPORAL FINITE DIFFERENCE; THERMAL RESIDUAL STRESSES; THERMAL SHOCK; ZERO MISFIT STRESS TEMPERATURE;

LAMINATES;

EID: 0035790526     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.2001.tb01100.x     Document Type: Article

References (14)

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2. D. Sherman, "Alumina/NiCu Laminate under Thermal Shock up 1000°C; I. Experimental," J. Am. Ceram. Soc., 84 [12] 2819-26 (2001).
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14. H. F., Nied, "Thermal Shock Fracture in an Edge-Cracked Plate," J. Therm. Stress, 6, 217-29 (1983).