Alumina/NiCu Laminate under Thermal Shock up to 1000°C: I, Experimental

Journal of the American Ceramic Society

Volumn 84, Issue 3-12, 2001, Pages 2819-2826

  Sherman, Dov ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; BONDING; COPPER; CRACK INITIATION; DIFFUSION; HIGH TEMPERATURE EFFECTS; INTERFACES (MATERIALS); METALLIC FILMS; NICKEL COMPOUNDS; QUENCHING; STRENGTH OF MATERIALS; WATER;

MECHANICAL RESIDUAL STRENGTH; THERMAL SHOCK; THREE POINT BENDING TEST;

LAMINATES;

EID: 0035790109     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.2001.tb01099.x     Document Type: Article

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