Tensile creep in the next generation silicon nitride

Ceramic Engineering and Science Proceedings

Volumn 22, Issue 3, 2001, Pages 167-174

  Lofaj, František ^a,c   Wiederhorn, Sheldon M ^a   Long, Gabrielle G ^a   Jemian, Pete R ^b  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^c INSTITUTE OF MATERIALS RESEARCH   (Slovakia)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; CAVITATION; CREEP; EXTRAPOLATION; MATHEMATICAL MODELS; PHASE COMPOSITION; STRAIN; TENSILE STRENGTH; THERMAL EFFECTS; TRANSMISSION ELECTRON MICROSCOPY; VISCOSITY; X RAY SCATTERING;

CREEP RATE; MULTIGRAIN JUNCTION CAVITIES; SMALL ANGLE X RAY SCATTERING; TENSILE CREEP; THRESHOLD STRESS;

SILICON NITRIDE;

EID: 0035789063     PISSN: 01966219     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1002/9780470294680.ch19     Document Type: Conference Paper

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