Micromachining of packaging materials for MEMS using lasers

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4557, Issue , 2001, Pages 220-224

  Kancharla, Vijay V ^a   Hendricks, Kira K ^a   Chen, Shaochen ^a  

^a IOWA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; ELECTRONICS PACKAGING; GLASS; HERMETIC SEALS; LASER ABLATION; LITHOGRAPHY; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; POLYMERS; POLYSTYRENES; PULSED LASER APPLICATIONS; SEMICONDUCTING SILICON;

LASER MACHINING; MICROPATTERNING;

MICROMACHINING;

EID: 0035769680     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.442948     Document Type: Conference Paper

References (8)

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8. 3 - TiC ceramics: laser induced modifications of surface topography and structure," Applied Surface Science, Vol. 127-129, pp.831-836.