Stiction-free release etch with anhydrous HF/water vapor processes

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4557, Issue , 2001, Pages 58-68

  Hanestad, Ron ^a   Butterbaugh, Jeffery W ^a   Ben Hamida, Abdselem ^b   Gelmi, Ilaria ^c  

^a FSI International   (United States)

^b Immeuble le Grenat   (France)

^c STMICROELECTRONICS   (Italy)

Author keywords

Anhydrous HF; Film compatibility; MEMS release; Stiction free

Indexed keywords

ACCELEROMETERS; ALUMINUM; DEGRADATION; ETCHING; FABRICATION; GOLD; PHOTORESISTORS; SILICA; SILICON NITRIDE; STICTION; VAPORS;

WAFER DICING FILMS;

MICROELECTROMECHANICAL DEVICES;

EID: 0035767676     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.442986     Document Type: Article

References (12)

1. K. Markus, "MEMS now challenging the fab technology base", Micromachine Devices, pp. 1-3, Vol. 2(4), April 1997.
2. R. Legtenberg, H.A.C. Tilmans, J; Elders and M. Elwespock, "Stiction of surface micro-machined structures after rinsing and drying: model and investigation of adhesion mechanisms" Sensors and actuators A 43, pp. 230-238, 1994.
3. C.H. Mastrangelo, and G.S. Saloka, Proceedings IEEE-MEMS, p.77, 1993.
4. D. Kobayashi, C.J. Kim, H. Fujita, "Photoresist assisted release of movable microstructures", Japanese Journal of Applied Physics, 32, pp. L1642 - L1644, 1993.
5. R.L. Alley, G.J. Cuan, R.T. Howe and K. Komvopoulos, Technical Digest of the Solid State Sensor and Actuator Workshop., p. 102, 1992.
6. A. Kovacs and A. Stoffel, Journal of Micromechanical and Micro-engineering 2, P. 190, 1992.
7. th June, pp. 269-299, 1993.
8. H. Guckel, J.J. Sniegowski and T.R. Christenson. "The application of fine grained Tensile Polysilicon to Mechanically resonant Transducers" Sensors and Actuators, A21-A23, pp. 346-351, 1990.
9. th International Conference on Solid State Sensors and Actuators - Eurosensors IX. Digest of Technical Paper, Volume 1, p. 589, 1995.
10. Y.I. Lee et al., "Dry release for surface micromachining with HF vapor phase etching", Journal of Microelectromechanical Systems, Vol. 6 (3), p. 226, 1997.
11. J. Mehta; US Patent 5,567,332; 1996.
12. S. Audet, K. Edenfeld, P. Bergstrom, "Motorola wafer-level packaging for integrated sensors", Micromachine Devices, Vol. 2(1), January 1997.