An integrated cavity wafer level chip size package for MEMS applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4557, Issue , 2001, Pages 183-191

  Weiss, Danny ^a   Teomim, Doron ^a   Badihi, Avner ^a   Zilber, Gil ^a  

^a Shellcase Ltd   (Israel)

Author keywords

CSP; MEMS; Micromechanics; Package; Semiconductor; SMT; Wafer Level; WLCSP

Indexed keywords

CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; GYROSCOPES; MICROACTUATORS; MICROMACHINING; MICROSENSORS; MIRRORS; THIN FILMS; WSI CIRCUITS;

WAFER LEVEL CHIP SIZE PACKAGES (WLCSP);

MICROELECTROMECHANICAL DEVICES;

EID: 0035766169     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.442942     Document Type: Article

References (2)

1. I. Shweky, A. Badihi, "A CSP Optoelectronic Package For Imaging And Light Detection Applications", SPIE proceedings on Electronic Imaging 99, January 1999.
2. A. Badihi, "CSP for CMOS Image Sensors". Advanced Packaging, pp 40-44, October 1999.