CSP for CMOS image sensors

Advanced Packaging

Volumn 8, Issue 9, 1999, Pages 40-44

  Badihi, Avner ^a  

^a ShellCase Ltd   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0010876948     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (3)

1. A. Badihi et al., "ShellPACK Integrated Circuit Package," Semicon West, CSP Session, June 1996.
2. A. Badihi et al., "ShellBGA: A Thin Chip Size Integrated Circuit Package," ISHM Workshop on CSP, August 1996.
3. Y. C. Lee, "Studies on Solder Self-Alignment," LEOS '94 Conference Proceedings, Vol. 1, pp. 73-74.