Enhanced amorphous silicon technology for 320×240 microbolometer arrays with a pitch of 35 μm

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4369, Issue , 2001, Pages 250-256

  Mottin, Eric ^a   Martin, Jean Luc ^a   Ouvrier Buffet, Jean Louis ^a   Vilain, Michel ^a   Bain, Astrid ^a   Yon, Jean Jacques ^a   Tissot, Jean Luc ^a   Chatard, Jean Pierre ^a  

^a CEA LETI   (France)

Author keywords

Amorphous silicon; Focal plane array; Microbolometer; Packaging

Indexed keywords

AMORPHOUS SILICON; CMOS INTEGRATED CIRCUITS; COST EFFECTIVENESS; ELECTRONICS PACKAGING; ELECTROOPTICAL EFFECTS; PHYSICAL VAPOR DEPOSITION; POLYIMIDES; READOUT SYSTEMS; SIGNAL TO NOISE RATIO;

COST REDUCTION; FOCAL PLANE ARRAY; MICROBOLOMETER; NOISE EQUIVALENT TEMPERATURE DIFFERENCE; READOUT INTEGRATED CIRCUIT;

BOLOMETERS;

EID: 0035761583     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.445293     Document Type: Conference Paper

References (2)

1. "320×240 microbolometer uncooled IRFPA development", J.L. Tissot, J.L. Martin, E. Mottin, M. Vilain, J.J. Yon, J.P. Chatard Vol. 4130, Infrared technology and Applications XXVI pp. 473-479, 2000
2. Low cost, low power uncooled a-Si based micro infrared micro infrared camera", T. Shiemert, D. Ratcliff, R. Gooch, B. Ritchey, P. Mc Cardel, J. Brady, K. Rachels, S. Ropson, M. Wand, J. Wynn, SPIE Vol 3597, Conference on sensors, 1998