Composite effects of reflections and ground bounce for signal vias in multi-layer environment

Asia-Pacific Microwave Conference Proceedings, APMC

Volumn 3, Issue , 2001, Pages 1127-1130

  Lin, Sheng Mou ^a   Wu, Ruey Beei ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; COMPUTER SIMULATION; ELECTRIC LINES; ELECTROMAGNETIC WAVE PROPAGATION; EQUIVALENT CIRCUITS; FINITE DIFFERENCE METHOD; INDUCTANCE; SPURIOUS SIGNAL NOISE; TIME DOMAIN ANALYSIS;

COMPOSITE EFFECTS; GROUND BOUNCE;

SIGNAL THEORY;

EID: 0035731243     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/apmc.2001.985330     Document Type: Conference Paper

References (5)

1. Full wave analysis of propagation characteristic of a through hole using the finite-difference time-domain method
2. FDTD modeling of noise in computer packages
3. Modeling of delta-I noise in digital electronics packaging
4. Model interaction between signal vias and metal planes on electronics packaging
5. Equivalent circuit of a through hole via in multi-layer environment