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Volumn , Issue , 1992, Pages 59-61

Equivalent circuit of a through via in multi-layer environment

Author keywords

[No Author keywords available]

Indexed keywords


EID: 77952745589     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.1992.572265     Document Type: Conference Paper
Times cited : (4)

References (2)
  • 1
    • 0024029374 scopus 로고
    • Quasi-static analysis of a microstrip via through a hole in a ground plane
    • June
    • T. Wang, R. F. Harrington, and J. R. Mautz, "Quasi-static analysis of a microstrip via through a hole in a ground plane, " IEEE Trans. Microwave Theory Tech., Vol. MTT-36, pp. 1008-1013, June 1988.
    • (1988) IEEE Trans. Microwave Theory Tech. , vol.MTT-36 , pp. 1008-1013
    • Wang, T.1    Harrington, R.F.2    Mautz, J.R.3
  • 2
    • 0026817527 scopus 로고
    • Inductance and resistance computations for three-dimensional multiconductor interconnection structures
    • Feb.
    • R. B. Wu, C. N. Kuo, and K. K. Chang, "Inductance and resistance computations for three-dimensional multiconductor interconnection structures, " IEEE Trans. Microwave Theory Tech., Vol. MTT-40, pp. 000-000, Feb. 1992.
    • (1992) IEEE Trans. Microwave Theory Tech. , vol.MTT-40
    • Wu, R.B.1    Kuo, C.N.2    Chang, K.K.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.