Global modeling and simulation of system-on-chip embedding MEMS devices

International Conference on ASIC, Proceedings

Volumn , Issue , 2001, Pages 666-669

  Juneidi, Z ^a   Torki, K ^a   Martinez, S ^a   Nicolescu, G ^a   Courtois, B ^a   Jerraya, A ^a  

^a TIMA LABORATORY   (France)

Author keywords

Behavioral modeling; Global simulation; MEMS; Optical co simulation; System on chip; Thermal co simulation

Indexed keywords

C (PROGRAMMING LANGUAGE); COMPUTER AIDED DESIGN; COMPUTER HARDWARE; COMPUTER HARDWARE DESCRIPTION LANGUAGES; COMPUTER SIMULATION; COMPUTER SOFTWARE; MICROELECTROMECHANICAL DEVICES; MICROPROCESSOR CHIPS; OPTICAL INTERCONNECTS;

BEHAVIORAL MODELING; MULTILANGUAGE MODELING; OPTICAL CO-SIMULATION; SYSTEMS ON CHIP; SYSTEMS ON PACKAGE; THERMAL CO-SIMULATION;

ELECTRONICS PACKAGING;

EID: 0035726218     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

References (12)

1. Micromachining for optical and optoelectronic systems
2. N2C
3. A hardware software Co-simulation environment
4. A hardware software cosimulation environment
5. CAD for microelectromechanical systems
6. A heterogeneous environment for computational prototyping and simulation based design of MEMS devices
7. Dynamic simulation of optical MEM switches
8. Electro-thermal and logi-thermal simulation on VLSI designs
9. Fine structure of heat flow path in semiconductor devices: A measurement and identification method
10. Analysis of thermal transient data with synthesized dynamic models for semi-conductors devices