A method to improve the efficiency of CMP process

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 4, 2001, Pages 661-666

  Shaw, Dein ^a   Chang, Jassy ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Chemical mechanical polishing; Clamping conditions; Efficiency improvement

Indexed keywords

BOUNDARY CONDITIONS; MATHEMATICAL MODELS; PRESSURE DISTRIBUTION; WSI CIRCUITS;

WAFER CARRIERS;

CHEMICAL MECHANICAL POLISHING;

EID: 0035696882     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.974958     Document Type: Article

References (6)

1. Chemical processes in glass polishing
2. Modeling of the wear mechanism during chemical mechanical polishing
3. The theory and design of plate glass polishing machine
4. Tribology analysis of chemical mechanical polishing
5. Modeling of chemical-mechanical polishing with soft pad
6. Re-examination of pressure and speed dependencies of removal rate during chemical mechanical polishing processes