Investigations into the use of SU-8 in the fabrication of a micro-optical bench for hybrid optoelectronic integration and packaging

IEEE High Frequency Postgraduate Student Colloquium

Volumn , Issue , 2001, Pages 164-167

  Farrington, Novak E S ^a   Iezekiel, Stavros ^a  

^a UNIVERSITY OF LEEDS   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; HYBRID INTEGRATED CIRCUITS; INTEGRATED CIRCUIT MANUFACTURE; MICROLENSES; MICROMACHINING; MICROOPTICS; MIRRORS; PHOTORESISTS;

HYBRID OPTOELECTRONIC INTEGRATION; ULTRATHICK NEGATIVE PHOTORESIST;

INTEGRATED OPTOELECTRONICS;

EID: 0035695997     PISSN: 15466523     EISSN: None     Source Type: Journal    
DOI: 10.1109/HFPSC.2001.962192     Document Type: Article

References (5)

1. Passive alignment optical subassemblies for military/aerospace fiber-optic transmitter/receiver modules
2. Fundamentals of microfabrication
3. Micromachining applications of a high resolution ultrathick photoresist
4. A new micro-machined millimeter-wave and terahertz snap-together rectangular waveguide technology