Microwave multichip modules using low cost microwave chip on flex packaging technology

Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

Volumn 1998-April, Issue , 1998, Pages 262-267

  McNulty, M ^a   Schnell, J ^a   Nixon, D ^a  

^a Lockheed Martin Gov Electron Syst   (United States)

Author keywords

Flex; High Density Interconnect; Microwave; Multichip Module; Packaging; Plastic

Indexed keywords

CHIP SCALE PACKAGES; COSTS; FILM PREPARATION; INTEGRATED CIRCUIT INTERCONNECTS; MICROPROCESSOR CHIPS; MICROWAVES; MILITARY APPLICATIONS; PACKAGING; PLASTICS; RADAR; RADAR EQUIPMENT; THIN FILM CIRCUITS;

CHIP-ON-FLEX PACKAGING; ELECTRICAL PERFORMANCE; FLEX; HIGH DENSITY INTERCONNECTS; MULTI-LAYER THIN FILM; PHASED-ARRAY RADAR APPLICATIONS; RADAR APPLICATIONS; TRANSMIT/RECEIVE MODULES;

MULTICHIP MODULES;

EID: 0007772222     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1998.670791     Document Type: Conference Paper

References (6)

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5. McNulty, M. et al., "Reliability Plan for Microwave Chip on Flex Multichip Modules", 1997 Advanced Electronics Acquisition, Qualification, And Reliability Workshop Proceedings
6. Bloomer, C., et al., "Failure Mechanisms is 95-104, 1997.