3D packaging of a microfluidic system with sensory applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3224, Issue , 1997, Pages 161-168

  Morrissey, A ^a   Kelly, G ^a   Alderman, J ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

3D; ISFET; Micropump; Microsystem packaging; Multichip module; Sensor; Stress

Indexed keywords

CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT MANUFACTURE; FIELD EFFECT TRANSISTORS; MICROSYSTEMS; MULTICHIP MODULES; OPTICAL DEVICES; OPTICAL FIBERS; PUMPS; RELIABILITY; SENSORS; SWITCHING SYSTEMS;

3D; 3D ASSEMBLIES; 3D PACKAGING; ACTIVE AREAS; HIGH DENSITIES; IMPROVED PERFORMANCES; INDUCED STRESSES; ISFET; LOW STRESSES; MICROFLUIDIC SYSTEMS; MICROMACHINED SILICONS; MICROPUMP; MICROSYSTEM PACKAGING; MICROSYSTEM TECHNOLOGIES; MICROVALVES; OPTICAL FIBRES; PACKAGING PROCESSES; POWER SUPPLY MODULES; SENSOR CHIPS; TEST CHIPS;

ELECTRONICS PACKAGING;

EID: 0007044985     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.284511     Document Type: Conference Paper

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