Creep behavior and microstructural stability of lamellar γ-TiAl (Cr, Mo, Si, B) with extremely fine lamellar spacing

Materials Research Society Symposium - Proceedings

Volumn 646, Issue , 2001, Pages

  Schillinger, Wolfram ^a   Zhang, Dezhi ^a   Dehm, Gerhard ^a   Bartels, Arno ^a   Clemens, Helmut ^a  

^a HAMBURG UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COMPRESSION TESTING; CREEP TESTING; HEAT TREATMENT; METALLOGRAPHIC MICROSTRUCTURE; OPTICAL MICROSCOPY; STRESS ANALYSIS; THERMODYNAMIC STABILITY; TRANSMISSION ELECTRON MICROSCOPY;

MICROSTRUCTURAL STABILITY;

TITANIUM ALLOYS;

EID: 0035557542     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)