An optimal liner for copper damascene interconnects

Advanced Metallization Conference (AMC)

Volumn , Issue , 2001, Pages 541-547

  Edelstein, D ^a   Uzoh, C ^a   Cabral Jr , C ^a   DeHaven, P ^a   Buchwalter, P ^a   Simon, A ^a   Cooney III, E ^a   Malhotra, S ^a   Klaus, D ^a   Rathore, H ^a   Agarwala, B ^a   Nguyen, D ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; DIFFUSION IN SOLIDS; ELECTRIC CONDUCTIVITY; ELECTROMIGRATION; ELECTROPLATING; INTERCONNECTION NETWORKS; INTERFACES (MATERIALS); METALLIC FILMS; MICROPROCESSOR CHIPS; PHYSICAL VAPOR DEPOSITION; SPUTTER DEPOSITION;

COPPER DAMASCENE INTERCONNECTS;

ULSI CIRCUITS;

EID: 0035555433     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)