Triangular voltage sweep characterization of copper ion migration induced by pre-sputter etch in dual-damascene CU/FSG interconnect structures

Advanced Metallization Conference (AMC)

Volumn , Issue , 2001, Pages 441-446

  Mallikarjunan, A ^a   Faust, R ^a   Tsu, R ^a   Russell, Noel M ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DIFFUSION; ELECTROMIGRATION; ELECTRON MOBILITY; SPUTTERING;

MOBILE ION CONTAMINATION;

ETCHING;

EID: 0035555355     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)