Barrier process for damascene integration of developmental porous silk™ resin films

Advanced Metallization Conference (AMC)

Volumn , Issue , 2001, Pages 307-311

  Tokei Zs ^a   Waeterloos, J J ^a   Iacopi, F ^a   Caluwaerts, R ^a   Struyf, H ^a   Van Aelst, J ^a   Maex, K ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ETCHING; INTERCONNECTION NETWORKS; IONIZATION OF SOLIDS; METALLIZING; PHYSICAL VAPOR DEPOSITION; POROSITY; POROUS MATERIALS; RESINS; SEMICONDUCTING SILICON COMPOUNDS;

METALLIC BARRIERS;

DIELECTRIC FILMS;

EID: 0035555328     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)