Bridging the chip/package process divide

Advanced Metallization Conference (AMC)

Volumn , Issue , 2001, Pages 129-136

  Bernhard Pogge, H ^a   Prasad, Chandrika ^a   Yu, Roy ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; INTERCONNECTION NETWORKS; MICROPROCESSOR CHIPS; ULSI CIRCUITS;

COMPUTER CHIPS;

CHIP SCALE PACKAGES;

EID: 0035554805     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)