Methods for passive fiber chip coupling of integrated optical devices

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 4, 2001, Pages 450-455

  Hauffe, R ^a   Siebel, U ^a   Petermann, K ^a   Moosburger, R ^b   Kropp, J R ^c   Arndt, F ^d  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b Virtual Photonics Incorporated   (Germany)

^c INFINEON TECHNOLOGIES AG   (Germany)

^d SIEMENS AG   (Germany)

Author keywords

Integrated optics; Passive fiber chip coupling; Polymer; Silicon

Indexed keywords

INTEGRATED OPTICAL DEVICES; PASSIVE FIBER CHIP COUPLING;

ELECTRONICS PACKAGING; INTEGRATED OPTICS; PHOTORESISTS; SILICON ON INSULATOR TECHNOLOGY; WAVELENGTH DIVISION MULTIPLEXING;

SINGLE MODE FIBERS;

EID: 0035521096     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.982828     Document Type: Article

References (12)

1. Passive alignment technique for all-silicon integrated optics
2. Passive alignment of single mode fibers to integrated polymer waveguide structures utilizing a single mask process
3. Self-alignment technique for fiber attachment to guided wave devices
4. Hybridization of optoelectronic components on silicon substrate
5. Self-aligned optical flip-chip OEIC packaging technologies
6. Large single-mode rib waveguides in GeSi-Si and Si-on-SiO2
7. Comparison of optical waveguide losses in silicon-on-insulator
8. Design concept for single mode polymer waveguides
9. Single mode optical waveguides using a high temperature stable polymer with low loss in the 1.55 μm range
10. Properties of optical rib guides with large cross sections
11. The single mode condition for rib waveguides, revised
12. Successful development of nonplanar lithography for micromachining applications