Passive Alignment Technique for All-Silicon Integrated Optics

Optics InfoBase Conference Papers

Volumn , Issue , 1996, Pages 565-568

  Moosburger, R ^a   Schuppert B ^a   Fischer, U ^a   Petermann, K ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED OPTICS; OPTICAL FIBER COMMUNICATION; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES;

ALIGNMENT TECHNIQUE; INTEGRATED OPTICAL DEVICES; MANUFACTURABILITY; PASSIVE ALIGNMENT; POSITIONING ACCURACY; SELF-ALIGNED; SELF-ALIGNMENT; SEMICONDUCTOR TECHNOLOGY; SILICON INTEGRATED OPTICS; SILICON-BASED;

SILICON;

EID: 5344241089     PISSN: None     EISSN: 21622701     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. E.J. Murphy, T.C. Rice, „Self-Alignment Technique for Fiber Attachment to Guided Wave Devices", IEEE Journal of Quantum Electronics, Vol. QE-22, No. 6 (1986), pp. 928-932
2. G. Grand, C. Artigue, „Hybridisation of Optoelectronic Components on Silicon Substrate", ECOC'94, pp 193-200
3. W. Hunziker et al., „Self-Aligned Optical Flip-Chip OEIC Packaging Technologies", ECOC'93, WeP7.1, Montreux
4. A. Steckenborn, et al., „High Precision Wafer Orientation for Micromachining", Micro Systems Technologies 1991, Berlin, Germany
5. 2", IEEE Journal of Quantum Electronics, Vol. 27 No. 8 (1991), pp. 1971-1974
6. T. Zinke, U. Fischer, B. Schüppert, A. Splett und K. Petermann, „Comparison of optical waveguide losses in silicon-on-insulator", Electronics Letters, Vol. 29, Nr. 23, (1993), pp. 2031-2033