Thermally conductive dielectrics for insulated metal core cards

Materials Science and Engineering B

Volumn 45, Issue 1-3, 1997, Pages 59-68

  Kuczynski, J ^a   Sinha, A ^a   Stephanie, J ^a  

^a IBM   (United States)

Author keywords

Metal core cards; Surface mount technology; Thermally conductive dielectrics

Indexed keywords

CHEMICAL MODIFICATION; DELAMINATION; EPOXY RESINS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; RUBBER; STRESS ANALYSIS; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EXPANSION;

INSULATED METAL CORE CARDS; THERMAL EXPANSION COEFFICIENT;

DIELECTRIC MATERIALS;

EID: 0031094282     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5107(96)01658-3     Document Type: Article

References (6)

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6. Machine Design, Non-Ferrous Metals Materials Reference Issue, Penton, Cleveland, April 1988, pp. 206-236.