A precision capacitance cell for measurement of thin film out-of-plane expansion-Part III: Conducting and semiconducting materials

IEEE Transactions on Instrumentation and Measurement

Volumn 50, Issue 5, 2001, Pages 1212-1215

  Snyder, Chad R ^a,b   Mopsik, Frederick I ^b  

^a IEEE   (United States)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

Capacitance cell; Coefficient of thermal expansion (CTE); Guarded electrode; High sensitivity displacement; Inner layer dielectrics; Polymers; Thin films

Indexed keywords

CAPACITANCE CELL; CONDUCTING MATERIALS; GUARDED ELECTRODE; HYGROTHERMAL EXPANSION; INNER LAYER DIELECTRICS; SINGLE CRYSTAL SILICON;

DATA REDUCTION; DESIGN; ELECTRIC INSULATORS; ELECTRODES; ELECTRONICS PACKAGING; PLASTIC FILMS; SEMICONDUCTOR MATERIALS; SILICON; SINGLE CRYSTALS; THERMAL EXPANSION; THIN FILMS;

CAPACITANCE MEASUREMENT;

EID: 0035483933     PISSN: 00189456     EISSN: None     Source Type: Journal    
DOI: 10.1109/19.963185     Document Type: Article

References (15)

1. Film thickness dependent thermal-expansion in ultrathin poly(methyl methacrylate) films on silicon
2. Size-dependent depression of the glass-transition temperature in polymer films
3. Molecular-structure and thermal-mechanical properties of polymer thin-films
4. Thermal expansion of poly(vinylidene fluoride) films
5. Thermal expansion of irradiated polystyrene
6. Thickness direction coefficient of thermal expansion measurement of thin polymer films
7. Advances in the measurement of polymer CTE: Micrometer-to-atomic-scale measurements
8. A precision capacitance cell for measurement of thin film out-of-plane expansion. I. Thermal expansion
9. A precision capacitance cell for measurement of thin film out-of-plane expansion. II. Hygrothermal expansion
10. The fundamental physical constants
11. Table of dielectric constants and electric dipole moments of substances in the gaseous state
12. Recommended values for the thermal expansivity of silicon from 0 to 1000 K
13. An industry/government/university partnership: Measuring sub-micrometer strain in polymer films