Advances in the measurement of polymer CTE: Micrometer-to atomic-scale measurements

American Chemical Society, Polymer Preprints, Division of Polymer Chemistry

Volumn 37, Issue 1, 1996, Pages 180-182

  Schen, Michael ^a   Mopsik, F I ^a   Wu, W ^a   Wallace, W E ^a   Tan, N C Beck ^a   Davis, G T ^a   Guthrie, W ^b  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE MEASUREMENT; DENSITY MEASUREMENT (SPECIFIC GRAVITY); ELECTROMAGNETIC WAVE REFLECTION; GLASS TRANSITION; INTERFACES (MATERIALS); MEASUREMENT ERRORS; MICROELECTRONICS; PERMITTIVITY; THERMAL EXPANSION; THICKNESS MEASUREMENT; ULTRATHIN FILMS; X RAY ANALYSIS;

THERMAL EXPANSION COEFFICIENTS; THERMOMECHANICAL ANALYZERS; X RAY REFLECTIVITY MEASUREMENTS;

PLASTIC FILMS;

EID: 0030092294     PISSN: 00323934     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (12)

1. National Technology Roadmap for Electronic Interconnections, Institute for Interconnecting and Packaging Electronic Circuits, 2215 Sanders Road, Northbrook, IL 60062-6135, phone: (708) 509-9700.
2. National Technology Roadmap for Semiconductors, Semiconductor Industry Association, 4300 Stevens Creek Blvd., Suite 271, San Jose, CA 95129, phone: (408) 246-2711.
3. Michael A. Schen, ed., Metrology and Data for Microelectronic Packaging and Interconnection, Results of a joint workshop, May 5-6, 1994, NISTIR 5520, November 1994.
4. Electronics Manufacturing Technology Roadmaps and Options for Government Action, National Electronics Manufacturing Framework Committee, Dec. 1994.
5. Commercial equipment and materials are identified in this report to adequately describe experimental procedures used. Such identification does not imply recommendation or endorsement by the National Institute of Standards and Technology, nor does it imply that the equipment identified is necessarily the best available for the purpose.
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8. W. Wu, J.H. Van Zanten, W.J. Orts, Thermal Expansion Measurements of Thin PMMA Films, Macromolecules, 28, 771, 1995.
9. W. Wu, W.J. Orts, C.J. Majkrzak, D.L. Hunston, Water Adsorption at Polyimide/Silicon Water Interface, Polymer Engineering and Science, 35(12), 1000-1004,
10. 1995.W. Wu, W.E. Wallace, J. van Zanten, Glass Transition Temperature of Ultrathin Polymer Films on Silicon, in Low-Dielectric Constant Materials - Synthesis and Applications in Microelectronics, T-M. Lu, S.P. Murarka, T.S. Kuan, C.H. Ting eds., Proceedings of the Materials Research Society, (Materials Research Society, Pittsburgh, PA) 381, pp147-152,
11. 1995.W.E. Wallace, W. Wu, , A Novel Method for Determining Thin Film Density by Energy-Dispersive X-ray Reflectivity, App. Phys. Lett., 67, 1203-1205, 1995.
12. W.E. Wallace, J.H. van Zanten, W. Wu, Influence of an Impenetrable Interface on a Polymer Glass-Transition Temperature, Bulletin of the American Physical Society, Series II, 40(1), 675, 1995.