Heat-Resistant Silicon Carbide with Aluminum Nitride and Erbium Oxide

Journal of the American Ceramic Society

Volumn 84, Issue 9, 2001, Pages 2060-2064

  Kim, Young Wook ^a   Mitomo, Mamoru ^b   Nishimura, Toshiyuki ^b  

^a University of Seoul   (South Korea)

^b NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM NITRIDE; ANNEALING; CERAMIC MATERIALS; COMPOSITION EFFECTS; ERBIUM COMPOUNDS; FRACTURE TOUGHNESS; GRAIN BOUNDARIES; HEAT RESISTANCE; HOT PRESSING; MICROSTRUCTURE; OXIDES; STRENGTH OF MATERIALS;

ERBIUM OXIDE; HEAT RESISTANT SILICON CARBIDE; SINTERING ADDITIVES;

SILICON CARBIDE;

EID: 0035470704     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.2001.tb00958.x     Document Type: Article

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