Effect of microalloying on the creep strength and microstructure of eutectic Sn-Pb solders

Key Engineering Materials

Volumn 171-174, Issue , 2000, Pages 663-668

  Wade, N ^a   Akuzawa, T ^b   Kunii, J ^c   Miyahara, K ^c  

^a Topy Industries Ltd   (Japan)

^b Nippon Filler Metals   (Japan)

^c NAGOYA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANTIMONY; COMPOSITION EFFECTS; COPPER; CREEP; EUTECTICS; FATIGUE OF MATERIALS; GALLIUM; METALLOGRAPHIC MICROSTRUCTURE; THERMAL STRESS; TIN; TIN ALLOYS;

MICROALLOYING; PARTICLE DISPERSION STRENGTHENING; RUPTURE STRENGTH; TIN LEAD ALLOYS;

SOLDERING ALLOYS;

EID: 0033882938     PISSN: 10139826     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. E.E. de Kluizenaar, Soldering and Surface Mount Technology, No.5, June, 56 (1990).
2. M. Ohtsuka, Material Life, 8, 72 (1906).
3. N. Wade, S. Yamada, T. Akuzawa, Y. Hosaka and K. Miyahara, Proc. of the 5th Symp. on Microjoining and Assembly Technology in Electronics "Mate '99" (Feb., 4-5, 1999, Yokohama, Japan), p.63.
4. Metal data book, (edited by Japanese Inst. of Metals, 1984, Maruzen Pub. Co. Ltd.), p.27.