Deep silicon etch modeling for fabrication of 200-mm SCALPEL masks

Microelectronic Engineering

Volumn 57-58, Issue , 2001, Pages 607-612

  Dauksher, W J ^a   Clemens, S B ^a   Resnick, D J ^a   Smith, K H ^a   Mangat, P J S ^a   Rauf, S ^b   Ventzek, P L G ^b   Arunachalam, V ^b   Ramamurthi, B N ^c   Ashraf, H ^d   Lea, L ^d   Hall, S ^d   Johnston, I R ^d   Hopkins, J ^d   Bhardwaj, J K ^d  

^a MOTOROLA INC   (United States)

^b MOTOROLA INC   (United States)

^c UNIVERSITY OF HOUSTON   (United States)

^d Surface Technology Systems plc   (United Kingdom)

Author keywords

Bosch etch process; Deep silicon etch modeling; SCALPEL mask

Indexed keywords

CORRELATION METHODS; DRY ETCHING; ELECTRON BEAM LITHOGRAPHY; FABRICATION; MATHEMATICAL MODELS; SEMICONDUCTING SILICON;

BOSCH ETCH PROCESS;

MASKS;

EID: 0035450888     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(01)00550-0     Document Type: Article

References (4)