Stress determination in pulse electroplated gold deposits

Transactions of the Institute of Metal Finishing

Volumn 79, Issue 5, 2001, Pages 160-162

  Rehrig, D L ^a   Mandich, N V ^a  

^a AGERE SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; COMPRESSIVE STRESS; ELASTIC MODULI; ELECTROPLATING; GRAIN SIZE AND SHAPE; LATTICE CONSTANTS; STRESS ANALYSIS; TENSILE STRESS;

ELECTROPLATED GOLD DEPOSITS;

GOLD DEPOSITS;

EID: 0035442068     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1080/00202967.2001.11871387     Document Type: Article

References (21)

1. Standard test method for measuring of internal stress of plated metallic coatings with spiral contractometer