Interface boundaries formed during electrodeposition

Materials Science Forum

Volumn 207-209, Issue PART 2, 1996, Pages 693-696

  Vikarchuk, A ^a   Vinogradov, A ^a   Nadtochy, M ^a  

^a TOGLIATTI STATE UNIVERSITY   (Russian Federation)

Author keywords

Electrodeposited Metals; Interface Boundaries; Stress Fields

Indexed keywords

COPPER; CRYSTAL STRUCTURE; DISLOCATIONS (CRYSTALS); DISSOCIATION; ELECTRODEPOSITION; GRAIN BOUNDARIES; NICKEL; STRESSES; TRANSMISSION ELECTRON MICROSCOPY;

DISLOCATION ARRANGEMENT; EXTINCTION CONTOURS; INTERFACE BOUNDARIES; MISORIENTATION ANGLE; NONEQUILIBRIUM STRUCTURE;

INTERFACES (MATERIALS);

EID: 0029707360     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.207-209.693     Document Type: Article

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